- Manufacture :
- Part Status :
- Packaging :
- Operating Temperature :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- RAM Size :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG (7)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG (2)
- CAN, EBI/EMI, Ethernet, I²C, USB OTG (18)
- CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG (3)
- EBI/EMI, Ethernet, I²C, SD/SDHC/SDIO, SmartCard, SPI, UART/USART, USB (2)
- Program Memory Size :
- Program Memory Type :
- Oscillator Type :
- Applied Filters :
32 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
|
|
RFQ |
3,464
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC51xx | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,813
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
2,586
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,547
In-stock
|
NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,607
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,578
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,417
In-stock
|
STMicroelectronics | LQFP 208 28X28X1.4 1 | STM32H7 | Active | Tray | -40°C ~ 85°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 168 | 1M x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 20x16b, D/A 2x12b | Internal | |||
|
|
RFQ |
3,508
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
2,477
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,749
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 364BGA | Vybrid, VF6xx | Obsolete | Tray | -40°C ~ 85°C | 364-LFBGA | 364-LFBGA (17x17) | DMA, LVD, WDT | ARM® Cortex®-A5 + Cortex®-M4 | 400MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | - | ROMless | - | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
|
|
RFQ |
2,256
In-stock
|
Maxim Integrated | IC MCU 32BIT ROMLESS 256LBGA | - | Active | - | - | - | - | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 400MHz | - | 160 | 384K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SD/SDHC/SDIO, SmartCard, SPI, UART/USART, USB | - | ROMless | - | A/D 3x10b | - | |||
|
|
VIEW | STMicroelectronics | HIGH-PERFORMANCE & DSP W/DP-FPU | $proddata[$product['id']]['package'] | STM32H7 | Active | -40°C ~ 85°C (TA) | 265-TFBGA | 240+25-TFBGA (14x14) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 168 | 1M x 8 | 32-Bit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 128KB (128K x 8) | Flash | A/D 36x16b, D/A 2x12b | Internal | |||||
|
|
|
RFQ |
100
In-stock
|
STMicroelectronics | HIGH-PERFORMANCE & DSP W/DP-FPU | $proddata[$product['id']]['package'] | STM32H7 | Active | -40°C ~ 85°C (TA) | 201-UFBGA | 176+25UFBGA (10x10) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 140 | 1M x 8 | 32-Bit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 128KB (128K x 8) | Flash | A/D 36x16b, D/A 2x12b | Internal | ||||
|
|
RFQ |
493
In-stock
|
STMicroelectronics | HIGH-PERFORMANCE & DSP W/DP-FPU | $proddata[$product['id']]['package'] | STM32H7 | Active | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 82 | 1M x 8 | 32-Bit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 128KB (128K x 8) | Flash | A/D 36x16b, D/A 2x12b | Internal | ||||
|
|
RFQ |
3,464
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC51xx | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,813
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
2,586
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,547
In-stock
|
NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,607
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
1,578
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
|
RFQ |
3,417
In-stock
|
STMicroelectronics | LQFP 208 28X28X1.4 1 | STM32H7 | Active | Tray | -40°C ~ 85°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 168 | 1M x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 20x16b, D/A 2x12b | Internal | |||
|
|
RFQ |
3,508
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
2,477
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,749
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 364BGA | Vybrid, VF6xx | Obsolete | Tray | -40°C ~ 85°C | 364-LFBGA | 364-LFBGA (17x17) | DMA, LVD, WDT | ARM® Cortex®-A5 + Cortex®-M4 | 400MHz | 3 V ~ 3.6 V | - | 1.5Mb | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | - | ROMless | - | A/D Dual x 12b, D/A Dual x 12b | Internal | |||
|
|
|
RFQ |
2,256
In-stock
|
Maxim Integrated | IC MCU 32BIT ROMLESS 256LBGA | - | Active | - | - | - | - | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 400MHz | - | 160 | 384K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SD/SDHC/SDIO, SmartCard, SPI, UART/USART, USB | - | ROMless | - | A/D 3x10b | - | |||
|
|
RFQ |
832
In-stock
|
STMicroelectronics | HIGH-PERFORMANCE & DSP DP-FPU AR | STM32H7 | Active | Tray | -40°C ~ 85°C (TA) | 201-UFBGA | 176+25UFBGA (10x10) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 140 | 1M x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 20x16b, D/A 2x12b | Internal | |||
|
|
RFQ |
1,269
In-stock
|
STMicroelectronics | 16/32-BITS MICROS | STM32H7 | Active | Tray | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.71 V ~ 3.6 V | 82 | 1M x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 20x16b, D/A 2x12b | Internal | |||
|
|
RFQ |
1,521
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
3,275
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | |||
|
|
RFQ |
845
In-stock
|
STMicroelectronics | HIGH-PERFORMANCE & DSP DP-FPU AR | STM32H7 | Active | Tray | -40°C ~ 85°C (TA) | 265-TFBGA | 240+25-TFBGA (14x14) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 400MHz | 1.62 V ~ 3.6 V | 168 | 1M x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 20x16b, D/A 2x12b | Internal | |||
