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Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Color | Packaging | Operating Temperature | Mounting Type | Termination | Features | Number of Positions | Number of Rows | Gender | Contact Finish | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Number of Positions/Bay/Row | Card Thickness | Read Out | Flange Feature | |
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GLOBAL STOCKS | |||||||||||||||||||||||||||||
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RFQ |
1,039
In-stock
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Latches, Locking Ramp | 50 | 2 | Female | Gold | 10.0µin (0.25µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 25 | 0.062" (1.57mm) | Dual | - | ||||
|
RFQ |
1,386
In-stock
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Latches, Locking Ramp | 26 | 2 | Female | Gold | 10.0µin (0.25µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 13 | 0.062" (1.57mm) | Dual | - | ||||
|
RFQ |
1,867
In-stock
|
Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Active | Black | Tray | -55°C ~ 125°C | Surface Mount | Solder | Board Guide, Latches, Locking Ramp | 18 | 2 | Female | Gold | 10.0µin (0.25µm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 9 | 0.062" (1.57mm) | Dual | - |